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WaferTrac / MicroTrac
M O D U L E S
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[
Spinner Module ] [ Coat Module ] [ Developer Module ] [ Hotplate Module ] [ Indexers ]


 

Microtrac Systems are production proven automated wafer processing systems for 75mm to 150mm diameter wafers. Founded in the  original Wafertrac 1006 product line (left), Microtrac is a reduced footprint version of the Wafertrac 1006 system using the same high performance wafer processing modules.

 

Standard Features

  • PC based system architecture 
  • Operator friendly graphics interface
  • Advanced system controller displays real time readout of spin speed, oven temperature, system messages and module status.
  • Supports SEMI equipment communications standard (SECS).
  • On or Off line diagnostics
  • Statistical data maintained on a per batch basis.
  • Work in Process (WIP) monitoring for all wafers
  • Computer controlled wafer transport.
  • Audible and visual alarms
  • Capacitive wafer sensing
  • Reliable air bearing wafer transport with 0.05 point of use filtration for gentle wafer handling…no moving parts to generate particles.
  • Teflon coated hard anodized track plates.
  • Stainless steel panels.
  • Class 10 operation, particulate control maintained at less than 0.03 particles per cm2 0 .03 or larger.

 

 

Spinner Module

  • 254 program steps, 0.1 second increments, 25.4 sec maximum time per program step.
  • Spin speed range 50-7500 RPM in 10 RPM increments.
  • Control to set point 2 RPM
  • 200 to 30,000/50,000 RPM programmable acceleration (150mm/100mm)
  • Acceleration increment 200 RPM per second

 


 

Coat Module

  • Compatible with most pump manufacturers
  • Backside edgebead removal
  • Bottle drains with pneumatic release

Optional System Features- Coat Module

    • Order up to 3 dispense nozzles (stationary).
    • Spinner agitation module.
    • Movable (dual) nozzle with predispense capability
    • Topside edgebead removal system
    • Low maintenance cup.
    • Direct chemical drain.
    • Teflon chemical protection package.
    • Progressive Technologies exhaust controller

 


  

Developer Module

  • Pressurized spray dispense with 15 liter canister
  • Self-cleaning dual dispense nozzle assembly for develop and DI rinse.
  • Puddle and dynamic spray dispense tips
  • Backside rinse system
  • DI topside flood rinse
  • Direct developer waste drain

Optional System Features- Developer Module

    • Up to one additional dual nozzle assembly.
    • Advanced temperature control unit- temperature range 10C - 30C, temperature control +0.5C at nozzle.
    • Coaxial fluid delivery to the nozzle.
    • Lechler® ultrasonic nozzles
    • Teflon® chemical protection package.
    • Spinner preventative maintenance kit.

 


 

Square Hotplate Bake Module

  • Soft bake, hard bake, dehydration bake, post-exposure bake, cascadable.
  • Temperature programmable 45 - 365C in 1 increments.
  • Temperature uniformity 1C up to 150C, 1% from 151 - 250C, 2%, 251 - 365C.
  • Bake time 1 - 2816 seconds, 1 second increments.
  • Cool plate programmable 1 - 255 seconds as function of bake temperature.
  • Air bearing transport and centering… no moving parts and no edge contact.     

 


Indexers

  • Send, receive, pass through or buffer modes.
  • Fluoroware compatible.
  • Capacitive wafer sensors.
  • 3/16" or 1/4" pitch

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