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Five
(5) Minute Size Conversion Random Access - Cluster tool
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Features
Innovative
architecture allows SWP-200 to be configured for your traditional
or most complex and challenging processes and/or wafers
and substrates. Available for Photoresists, Polyimides,
Photosensitive Polyimide, S.O.G., Low K, and thick or thin
film. Gentle and precision handling for processing of GaAs,
LiN, Si, SiC, InP, InT, SiN, InAs, InSb, GaSb Glass, Ceramic
and various other specialty materials.
Features:
- 1
or 2 Spin Process Modules
- Single
Coat, Single Develop, Dual-Coat, Dual-Develop or Coat/Develop
Patented solvent pools in the cup provide continuous
clean function and solvent rich stable environment.
- Linear
Programmable Motion Dispense Arms for Coater or Developer
- 1
to 8 Stacked Hotplates, Plus 1 or 2 Coolplate Buffers
- Robotic
Wafer transfer provided by patented Acrabot, 5 axis DSP
controlled handler
- Mini-environment
Enclosure
- Integrated
Electronics
- Built-in
barrier keeps liquids and vapors safely separated from
electronics and controls.
- Integrated
Chemical Control Bay
- Containment
and easy access for pumps, metering valves, constant
temperature fluid manifolds, and waste drains.
- Windows
Style User Interface, with On-line Help Manual, and module
diagnostic support
-
Process
cup with Patented process enhancements
- Two
position spin chuck height, high acceleration (1.25
HP) spin motor, Patented Spin Agitation, coupled with
high and low programmable exhaust gives the system the
flexibility to create both thick and thin coatings in
a production environment.
- Cool-On-Pins
capability
- Reduces
film stress in thick coatings.
Specifications:
Coater Capability:
Programmable
Spin Speed ................................ 1 RPM Increments
from 10 to 8,000 RPM
Accuracy ....................................................
250-8,000 RPM Better than +/- 2 RPM
Programmable Acceleration ..............................
200-50,000 RPM/Sec
Acceleration Control .......................................
Better than +/- 100 RPM/Sec
Patented Agitation motion ...............................
Minimize resist consumption, and improve coat planarization
Programmable Linear Dispense ..........................
Arm Motion programmable on 4 independently selectable arms
Stacked
Hotplates:
Programmable Temperature ..............................
35ēC to 400ēC Range with 0.1ēC increments
Temperature control .......................................
+/- .15 Deg C
Thermal Uniformity ........................................
+/- .2 Deg C
Programmable Proximity Bake ............................
5 Programmable pin positions above hotplate
Repeatability ................................................
Better than 25 um repeatability of proximity pin height
Fixed Proximity Bake ......................................
Optional 50 to 250 um fixed height offsets built into hotplate
Time at each bake step ...................................
0.0 to 600.0 seconds in 0.1 Second increments
Vacuum Hold Down .........................................
20.0 to 25.0 HG
HMDS
Prime:
Programmable Temperature ..............................
35ēC to 150ēC Range with 0.1ēC increments
Fixed Proximity Bake ......................................
75 um fixed height offsets built into hotplate
Time at each prime step ..................................
0.0 to 600.0 seconds in 0.1 Second increments
HMDS Containment ........................................
Prime performed at 5 inch HG followed by Nitrogen purge
Bake Cap Dehydration .....................................
20.0 HG
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