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10000 Series


 

The 10000 Series provides for automatic spin processing, cassette to cassette with two, three or four  process stations in single or dual lane configurations. For wafers/substrates up to 200mm diagonal dimensions. PC controlled with SVGA color monitor display.

10000 in "dual lane" configuration

 

Features

Processes:

Coat, Develop, HMDS Vapor Prime, Chill and Bake

Coat:

Solitec Pump (Teflon diaphragm), Pressurized Cartridge
Dispense, both with Solitec's exclusive Autocoat
Dispense Arm (programmable)

Develop:

Aspirated Atomized Spray, Pressurized Fan Spray, Solitec's exclusive Ultrasonic Optimist Spray, Harmonic Jet/metal lift-off  Strippers (stepper motor controlled), plus optional Temperature controlled Chemical Supply

Vapor Prime:

Wafer Pre-coat priming for increased adhesion. Standard temperature configuration to 250C

Chill:

Stabilizes wafer temperature after post exposure and Vapor Prime baking.


 

 

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