 |
|
|
|
|
Stand Alone Bake and HMDS Vapor Prime Modules
Semi-automatic: Manual load / unload
VBS-200
Single wafer / substrate, stand-alone HMDS Vapor Prime and Dehydration Bake module. Standard 3-pin lifter mechanism and
pneumatic operated bake cap for 4" to 8" wafers. Vacuum hold down for full contact bake. Vacuum assist chamber to decrease
bake times. Safety interlocks to ensure priming vapors remain in bake cap. Nitrogen purge before and after wafers are primed to ensure vapors are exhausted
prior to bake cap lifting.
SBS-200
Single wafer / substrate, stand-alone bake module. Optional 3-pin lifter
mechanism and pneumatic operated bake cap for 4" to 8" wafers. Vacuum hold
down for full contact bake. Vacuum assist chamber to decrease bake times.
|
|
|
|
The 51XX series provides spin processing of single wafers/substrates of up to 225mm diagonal. Semi-automatic
(manual load/unload) operation. 54XX provides semi-automatic, simultaneous processing of 4 wafers up to 100mm diagonal.The 7000 series provides spin processing of single
wafers up to 12" and substrates of up to 500mm diagonal dimensions. Semi-automatic (manual load/unload) operation. |
|
Ultrasonic nozzle is ideal for sub-micron processes |
|
|
 |
|
|
Processes: |
Coat, Develop, Scrub/Jet, and Etch |
Coat: |
Solitec Pump Dispense (Teflon Diaphragm), Pressurized Cartridge Dispense, or manual dispense. Most OEM Pump Supported. |
Develop: |
Aspirated Atomized spray, Pressurized Fan Spray, and Solitec's exclusive ultrasonic OPTIMIST spray, plus optional
temperature controlled chemical supply. |
|
Scrub/Jet: |
High pressure Jet (3000psi max.) with rotational scrub brush. |
|
|
|
|
