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Research and Pilot Production Systems

[ Stand Alone Bake ] [ 5000/7000 Series ]


Stand Alone Bake and HMDS Vapor Prime Modules
Semi-automatic: Manual load / unload

VBS-200
Single wafer / substrate, stand-alone HMDS Vapor Prime and  Dehydration Bake module. Standard 3-pin lifter mechanism and  pneumatic operated bake cap for 4" to 8" wafers.  Vacuum hold down for full contact bake. Vacuum assist chamber  to decrease bake times. Safety interlocks to ensure priming  vapors remain in bake cap . Nitrogen purge before and after  wafers are primed to ensure vapors are exhausted prior to  bake cap lifting.

    SBS-200
    Single wafer / substrate, stand-alone bake module. Optional  3-pin lifter
    mechanism and pneumatic operated bake cap for 4" to  8" wafers. Vacuum hold
    down for full contact bake. Vacuum assist chamber to decrease  bake times.


   

5000/7000 Series

 

The 51XX series provides spin processing of single wafers/substrates of up to 225mm diagonal. Semi-automatic (manual  load/unload) operation. 54XX provides semi-automatic, simultaneous processing of 4 wafers up to 100mm diagonal.

The 7000 series provides spin processing of single wafers up to  12" and substrates of up to 500mm diagonal dimensions. Semi-automatic (manual load/unload) operation.

 

Ultrasonic nozzle is ideal for sub-micron processes

Processes:

Coat, Develop, Scrub/Jet, and Etch

Coat:

Solitec Pump Dispense (Teflon Diaphragm), Pressurized Cartridge Dispense, or manual dispense. Most OEM Pump Supported.

Develop:

Aspirated Atomized spray, Pressurized Fan Spray, and Solitec's exclusive ultrasonic OPTIMIST spray, plus optional temperature  controlled chemical supply.

Scrub/Jet:

High pressure Jet (3000psi max.) with rotational scrub brush.

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