SWP-200
Five  (5) Minute Size Conversion Random Access - Cluster tool Features Innovative  architecture allows SWP-200 to be configured for your traditional  or most complex and challenging processes and/or wafers  and substrates. Available for Photoresists, Polyimides,  Photosensitive Polyimide, S.O.G., Low K, and thick or thin  film. Gentle and precision handling for processing of GaAs,  LiN, Si, SiC, InP, InT, SiN, InAs, InSb, GaSb Glass, Ceramic  and various other specialty materials. Features: 1  or 2 Spin Process Modules Single  Coat, Single Develop, Dual-Coat, Dual-Develop or Coat/Develop  Patented solvent pools in the cup provide continuous  clean function and solvent rich stable environment. Linear  Programmable Motion Dispense Arms for Coater or Developer      1  to 8 Stacked Hotplates, Plus 1 or 2 Coolplate Buffers     Robotic  Wafer transfer provided by patented Acrabot, 5 axis DSP  controlled handler Mini-environment  Enclosure Integrated  Electronics Built-in  barrier keeps liquids and vapors safely separated from  electronics and controls. Integrated  Chemical Control Bay Containment  and easy access for pumps, metering valves, constant  temperature fluid manifolds, and waste drains. Windows  Style User Interface, with On-line Help Manual, and module  diagnostic support Process  cup with Patented process enhancements Two  position spin chuck height, high acceleration (1.25  HP) spin motor, Patented Spin Agitation, coupled with  high and low programmable exhaust gives the system the  flexibility to create both thick and thin coatings in  a production environment.     Cool-On-Pins  capability Reduces  film stress in thick coatings.   Specifications:  Coater Capability: Programmable  Spin Speed ................................ 1 RPM Increments  from 10 to 8,000 RPM Accuracy ....................................................  250-8,000 RPM Better than +/- 2 RPM Programmable Acceleration ..............................  200-50,000 RPM/Sec Acceleration Control .......................................  Better than +/- 100 RPM/Sec Patented Agitation motion ...............................  Minimize resist consumption, and improve coat planarization  Programmable Linear Dispense ..........................  Arm Motion programmable on 4 independently selectable arms    Stacked  Hotplates: Programmable Temperature ..............................  35ºC to 400ºC Range with 0.1ºC increments Temperature control .......................................  +/- .15 Deg C Thermal Uniformity ........................................  +/- .2 Deg C Programmable Proximity Bake ............................  5 Programmable pin positions above hotplate Repeatability ................................................  Better than 25 um repeatability of proximity pin height Fixed Proximity Bake ......................................  Optional 50 to 250 um fixed height offsets built into hotplate Time at each bake step ...................................  0.0 to 600.0 seconds in 0.1 Second increments Vacuum Hold Down .........................................  20.0 to 25.0" HG   HMDS  Prime: Programmable Temperature ..............................  35ºC to 150ºC Range with 0.1ºC increments Fixed Proximity Bake ......................................  75 um fixed height offsets built into hotplate Time at each prime step ..................................  0.0 to 600.0 seconds in 0.1 Second increments HMDS Containment ........................................  Prime performed at –5 inch HG followed by Nitrogen purge Bake Cap Dehydration .....................................  20.0" HG