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FlexiFab
M O D U L E S

[ Positive Develop ] [ Coat ] [ Vacuum Bake ] [ Vacupryme ] [ Hot Plate ] [ Chill Plate ] [ Elevator ] [ Buffer ]



76mm to 200mm wafers

 

SYSTEM SPECIFICATIONS

 

Spin Motor

Central to the develop module's process capabilities, the FlexiFab spin motor is designed to provide range, reliability, and  control.

Spin Speed Range: 10-10,000 rpm (in 10 rpm increments)

Spin Speed Control: 1rpm (from 0-1000 rpm); 0.1% rpm; (from 1,000-10,000 rpm)

Acceleration Range: 250-50,000 rpm/sec; (in 250 rpm/sec increments)

Acceleration Control: 0.5% of set point

Develop Uniformity
 
(200mm wafer, 1, Resist Film)

Across Wafer:  0.04m for 0.5m line

Wafer to Wafer:  0.04m for 0.5m line

Lot to Lot:   0.04m for 0.5m line

Tighter specifications can be achieved with optional enhancements and/or process characterizations.

Process Control Options

Fluid Temperature Control: 15-30C; 0.25C

Programmable Exhaust: 0-700 linear ft/min; 0.10"- H2 O minimum; Controlled to set point; Within 15 milliseconds

Centering Device

The FlexiFab Develop Module is equiped with a patented circumferential centering device. Wafers are centered to  their true geometric center with minimum edge contact and no relative motion for vibration-free processing.

Accuracy:  0.003 (0.08mm)

Encoded Dispense Arm

FlexiFab's encoded dispense arm provides repeatable positioning of the dispense head over each wafer.

Accuracy:  0.0006 (0.16mm)

Arm Extend Speed Range: 0.1"-9.9" per second (in 0.1" increments)

Positive Develop Module

FlexiFab's self-contained Develop Module provides  unparalleled process performance and control in positive develop applications. When all of the features inherent to the FlexiFab Develop Module are merged together, they give the  process engineer the freedom and ability to achieve and maintain repeatable process results.

 Dedicated to positive develop processes, FlexiFab's Develop Module retains its reliability in whatever system configuration your process requires. The Develop Module employs a dynamic  dispense arm, versatile spin motor, and aerodynamic process bowl; coupled with a 360 symmetrical exhaust to ensure the process engineer complete process control. Available as  puddle, ultrasonic, aspirated and / or flat fan spray.

 

Standard

  • Teflon® Process Bowl
  • Delrin® Chuck
  • Encoded Dispense Arm
  • Programmable Backside Rinse
  • Programmable Process Cup Rinse
  • Dual Side Dispense
  • 360 Symetric Exhaust
  • Circumferential Centering Device
  • Delrin Centering Tips
  • DC Brushless Spin Motor
  • Optical Encoder
  • Digital rpm Control
  • Clockwise/Counterclockwise Capability
  • Water-Jacketed Motor
  • Cup Shroud
  • On-Board Microprocessor

 

Options

  • FlexiArm™ Robotic Handler
  • Additional Encoded Dispense Arm
  • Fluid Temperature Control
  • Sonotech Nozzle Dispense
  • Stream Nozzle Dispense
  • Fan-Spray Nozzle Dispense
  • Aspirated Nozzle Dispense
  • Dynamic Exhaust Controller
  • Lechler Ultrasonic


Coat Module

FlexiFab's self-contained Coat Module provides unparalleled process  performance and control in photoresist applications. When all of the features inherent to the FlexiFab Coat Module are merged together, they give the process engineer the freedom and ability to achieve  and maintain repeatable process results.

Dedicated to coating processes, FlexiFab's Coat Module retains its  reliability in whatever system configuration your process requires. The Coat Module employs a dynamic dispense arm, versatile spin motor, and aerodynamic process bowl; coupled with a reliable mass  flow exhaust controller to ensure the process engineer complete process control.

 

Standard

  • Teflon® Process Bowl
  • Delrin® Chuck
  • Encoded Dispense Arm
  • Programmable Predispense
  • Programmable Backside Rinse
  • Programmable Process Cup Rinse
  • Backside Edgebead Removal
  • Topside Edgebead Removal
  • 360 Symetric Exhaust
  • Exhaust Controller
  • Circumferential Centering Device
  • Delrin Centering Tips
  • DC Brushless Spin Motor
  • Optical Encoder
  • Digital rpm Control
  • Clockwise/Counterclockwise Capability
  • Water-Jacketed Motor
  • On-Board Microprocessor

Options

  • FlexiArm™ Robotic Handler
  • Additional Encoded Dispense Arm
  • Dual Side Dispense
  • Environmental Enclosure
  • Fluid Temperature Control
  • Integrated Pumping Systems: IDI, Millipore, Cybor, and others
  • Semco Dispense System
  • Dynamic Exhaust Controller


Vacuum Bake Module

FlexiFab's self-contained Vacuum Bake Module provides
unparalleled process performance and control in substrate curing applications. When all of the features inherent to the FlexiFab Vacuum Bake Module are merged together, they give the process  engineer the freedom and ability to achieve and maintain repeatable process results.

Dedicated to high temperature, vacuum bake processes,  FlexiFab's Vacuum Bake Module retains its reliability in whatever system configuration your process requires. The Vacuum Bake Module utilizes a hot plate capable of reaching 400C in a  vacuum environment, coupled with nitrogen treatment of the wafer for quicker curing of high viscosity materials. Supported by a reliable vacuum gauge, pressure gauge, and stainless steel  process chamber, FlexiFab's Vacuum Bake Module ensures the process engineer maximum contamination control

 

Standard

  • Stainless Steel Process Chamber
  • Vacuum Capability of 10 Millitorr
  • Vacuum Gauge (chamber Pressure)
  • High Temperature Hot-Plate Bake
  • N2 Dispense
  • Pressure Gauge (Nitrogen Dispense)
  • Wafer-Lift Pins
  • On-Board Microprocessor

Options

  • FlexiArm™ Robotic Handler
  • Vacuum Pump

 

Specifications

Temperature Range: 40C-400C

Temperature Uniformity: 40C-180C; 1C; 181C-400C; 2C

Vacuum Capability: Atmosphere to 10 millitorr


.

VacuPryme Module

FlexiFab's self-contained VacuPryme Module provides
unparalleled process performance and control in vapor prime applications. When all of the features inherent to the FlexiFab VacuPryme Module are merged together, they give the process  engineer the freedom and ability to achieve and maintain repeatable process results.

 

 Dedicated to adhesion-promotion processes, FlexiFab's VacuPryme Module retains its reliability in whatever system configuration your process requires. The VacuPryme Module utilizes a  vapor-phase priming in a vacuum environment to allow proper disassociation of water from the wafer plane. This, along with a stainless steel process chamber and hot-plate dehydration  bake, ensure the process engineer maximum process and contamination control.

Standard

  • Stainless Steel Process Chamber
  • Vacuum Capability of 10 Millitorr
  • Nitrogen Purge before Unload
  • Vacuum Gauge (Chamber Pressure)
  • Pressure Gauge (Nitrogen Dispense)
  • 1000ml Prime Fluid Flask
  • Hot-Plate Dehydration Bake
  • Prime Dispense(Time)
  • Prime Dispense(Pressure)
  • Wafer-Lift Pins
  • On-Board Microprocessor

Options

  • FlexiArm™ Robotic Handler
  • Vacuum Pump
  • 150ml Prime-Fluid Flask
  • Fluid Level Sensor                

Specifications

Temperature Range:  40C-180C

Temperature Uniformity:  1C

Wafer Contact Angle:  60-70 on bare  Si

Contact Angle Repeatability:  3

HMDS Consumption:  Process Dependent (0.1 - 0.2 ml/wafer, typical)

Vacuum Capability:  Atmosphere to 10 millitorr

Prime Dispense/Time:  0.1-second increments

Prime Dispense/Chamber Pressure: User programmed pressure


Hot Plate Module

Standard

  • Nickelized Copper Plate with
    Titanium Nitride Surface
  • Stepper-Motor Lift Pins
  • Contact Bake
  • Vacuum Pull-Down
  • Multiple Proximity Bake Positions
  • Programmable Bake Times
  • Programmable Pin Speed
  • RTD Temperature sensor
  • Nickelized Aluminum Funnel
  • 360 Symmetric Exhaust
  • Safety Snap Switch
  • On-Board Microprocessor

 Options

  • FlexiArm™ Robotic Handler
  • Quartz Cover
  • N2 Purge
  • Magnehelic Gauge (Safety Interlocks)
  • Exhaust Controller

Hot Plate Uniformity

Temperature Range: 40C-400C

Temperature Uniformity: 40C-150C; 0.5C
151C-400C; 0.5%

Programmable Temperature: 40C-400C

   (in 1C increments)

Programmable Time: 0-999 seconds
(in 0.1 second increments)

 

Chill Plate Module

  • Thermoelectric-junction chill mechanism, water -cooled for high-temperature substrates
  • Separate sensors for chill plate and substrate temperatures
  • Three pneumatically-controlled transfer pins
  • Substrate secured to plate by vacuum
  • Programmable from 15C-25C, in .1C increments, controlled to 0.5C
  • Substrate temperature setpoint programmable from chill plate temperature to 25C


Elevator Module

FlexiFab's self-contained Elevator Module provides unparalleled
process performance and control in substrate handling and transportation. When all of the features inherent to the FlexiFab Elevator Module are merged together, they give the process engineer  the freedom and ability to achieve and maintain repeatable process results.

Dedicated to safe and precise substrate handling FlexiFab's Elevator  Module retains its reliability in whatever system configuration your process requires. Compatible with all SEMI-Standard cassettes, the Elevator Module may be used as a Send, Receive, or a Send/Receive  unit. The reliable encoder-driven motor and programmable pitch function combine to give the process engineer complete process control.

Standard

  • Nylon-Coated Aluminum Cassette Platten
  • Send Module
  • Receive Module
  • Send/Receive Module
  • Encoder-Controlled Drive Motor
  • Slot-to-Slot Integrity (Send/Receive)
  • Programmable Pitch
  • On-Board Microprocessor

 Options

  • FlexiArm™ Robotic Handler
  • Wafer Mapping System
  • ProcessMatrix Software

Buffer Module

FlexiFab's self-contained Buffer Module provides unparalleled process performance and control in substrate handling and system integration. When all of the features  inherent to the FlexiFab Buffer Module are merged together, they give the process engineer the freedom and ability to achieve and maintain repeatable process results.

Dedicated to safe and precise substrate handling FlexiFab's  Buffer Module retains its reliability in whatever system configuration your process requires. The Buffer Module utilizes a stepper motor driven rotational plate, 270 spin radius, and  programmable pitch function to ensure the process engineer risk free substrate transport; while MTI's rugged FlexiArm™ handler drastically reduces the risk of particulate contamination.

Standard

  • Nylon-Coated Aluminum Cassette Platten
  • Rotational Table
  • Stepper Motor Drive
  • Low Friction Bearings
  • Opto-Sensors for Precise Positioning
  • Programmable Pitch
  • On-Board Microprocessor

 Options

  • FlexiArm™ Robotic Handler
  • Process Matrix Software

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