FlexiFab
M O D U L E S

[ Positive Develop ] [ Coat ] [ Vacuum Bake ] [ Vacupryme ] [ Hot Plate ] [ Chill Plate ] [ Elevator ] [ Buffer ]

76mm to 200mm wafers   SYSTEM SPECIFICATIONS Spin Motor Develop Uniformity Process Control Options Centering Device Encoded Dispense Arm Hot Plate Uniformity   Spin Motor Central to the develop module's process capabilities, the FlexiFab spin motor is designed to provide range, reliability, and  control. Spin Speed Range: 10-10,000 rpm (in 10 rpm increments) Spin Speed Control: ±1rpm (from 0-1000 rpm); ±0.1% rpm; (from 1,000-10,000 rpm) Acceleration Range: 250-50,000 rpm/sec; (in 250 rpm/sec increments) Acceleration Control: ±0.5% of set point Develop Uniformity   (200mm wafer, 1µ, Resist Film) Across Wafer:  0.04µm for 0.5µm line Wafer to Wafer:  0.04µm for 0.5µm line Lot to Lot:   0.04µm for 0.5µm line Tighter specifications can be achieved with optional enhancements and/or process characterizations. Process Control Options Fluid Temperature Control: 15-30ºC; ±0.25ºC Programmable Exhaust: 0-700 linear ft/min; 0.10"- H2 O minimum; Controlled to set point; Within 15 milliseconds Centering Device The FlexiFab Develop Module is equiped with a patented circumferential centering device. Wafers are centered to  their true geometric center with minimum edge contact and no relative motion for vibration-free processing. Accuracy:  ±0.003º (0.08mm) Encoded Dispense Arm FlexiFab's encoded dispense arm provides repeatable positioning of the dispense head over each wafer. Accuracy:  ±0.0006º (0.16mm) Arm Extend Speed Range: 0.1"-9.9" per second (in 0.1" increments)

Positive Develop Module FlexiFab's self-contained Develop Module provides  unparalleled process performance and control in positive develop applications. When all of the features inherent to the FlexiFab Develop Module are merged together, they give the  process engineer the freedom and ability to achieve and maintain repeatable process results.  Dedicated to positive develop processes, FlexiFab's Develop Module retains its reliability in whatever system configuration your process requires. The Develop Module employs a dynamic  dispense arm, versatile spin motor, and aerodynamic process bowl; coupled with a 360º symmetrical exhaust to ensure the process engineer complete process control. Available as  puddle, ultrasonic, aspirated and / or flat fan spray.   Standard Teflon® Process Bowl Delrin® Chuck Encoded Dispense Arm Programmable Backside Rinse Programmable Process Cup Rinse Dual Side Dispense 360º Symetric Exhaust Circumferential Centering Device Delrin Centering Tips DC Brushless Spin Motor Optical Encoder Digital rpm Control Clockwise/Counterclockwise Capability Water-Jacketed Motor Cup Shroud On-Board Microprocessor   Options FlexiArm™ Robotic Handler Additional Encoded Dispense Arm Fluid Temperature Control Sonotech Nozzle Dispense Stream Nozzle Dispense Fan-Spray Nozzle Dispense Aspirated Nozzle Dispense Dynamic Exhaust Controller Lechler Ultrasonic

Coat Module FlexiFab's self-contained Coat Module provides unparalleled process  performance and control in photoresist applications. When all of the features inherent to the FlexiFab Coat Module are merged together, they give the process engineer the freedom and ability to achieve  and maintain repeatable process results. Dedicated to coating processes, FlexiFab's Coat Module retains its  reliability in whatever system configuration your process requires. The Coat Module employs a dynamic dispense arm, versatile spin motor, and aerodynamic process bowl; coupled with a reliable mass  flow exhaust controller to ensure the process engineer complete process control.   Standard Teflon® Process Bowl Delrin® Chuck Encoded Dispense Arm Programmable Predispense Programmable Backside Rinse Programmable Process Cup Rinse Backside Edgebead Removal Topside Edgebead Removal 360º Symetric Exhaust Exhaust Controller Circumferential Centering Device Delrin Centering Tips DC Brushless Spin Motor Optical Encoder Digital rpm Control Clockwise/Counterclockwise Capability Water-Jacketed Motor On-Board Microprocessor Options FlexiArm™ Robotic Handler Additional Encoded Dispense Arm Dual Side Dispense Environmental Enclosure Fluid Temperature Control Integrated Pumping Systems: IDI, Millipore, Cybor, and others Semco Dispense System Dynamic Exhaust Controller

Vacuum Bake Module FlexiFab's self-contained Vacuum Bake Module provides unparalleled process performance and control in substrate curing applications. When all of the features inherent to the FlexiFab Vacuum Bake Module are merged together, they give the process  engineer the freedom and ability to achieve and maintain repeatable process results. Dedicated to high temperature, vacuum bake processes,  FlexiFab's Vacuum Bake Module retains its reliability in whatever system configuration your process requires. The Vacuum Bake Module utilizes a hot plate capable of reaching 400ºC in a  vacuum environment, coupled with nitrogen treatment of the wafer for quicker curing of high viscosity materials. Supported by a reliable vacuum gauge, pressure gauge, and stainless steel  process chamber, FlexiFab's Vacuum Bake Module ensures the process engineer maximum contamination control   Standard Stainless Steel Process Chamber Vacuum Capability of 10 Millitorr Vacuum Gauge (chamber Pressure) High Temperature Hot-Plate Bake N2 Dispense Pressure Gauge (Nitrogen Dispense) Wafer-Lift Pins On-Board Microprocessor Options FlexiArm™ Robotic Handler Vacuum Pump   Specifications Temperature Range: 40ºC-400ºC Temperature Uniformity: 40ºC-180ºC; ±1ºC; 181ºC-400ºC; ±2ºC Vacuum Capability: Atmosphere to 10 millitorr .

VacuPryme Module FlexiFab's self-contained VacuPryme Module provides unparalleled process performance and control in vapor prime applications. When all of the features inherent to the FlexiFab VacuPryme Module are merged together, they give the process  engineer the freedom and ability to achieve and maintain repeatable process results.    Dedicated to adhesion-promotion processes, FlexiFab's VacuPryme Module retains its reliability in whatever system configuration your process requires. The VacuPryme Module utilizes a  vapor-phase priming in a vacuum environment to allow proper disassociation of water from the wafer plane. This, along with a stainless steel process chamber and hot-plate dehydration  bake, ensure the process engineer maximum process and contamination control. Standard Stainless Steel Process Chamber Vacuum Capability of 10 Millitorr Nitrogen Purge before Unload Vacuum Gauge (Chamber Pressure) Pressure Gauge (Nitrogen Dispense) 1000ml Prime Fluid Flask Hot-Plate Dehydration Bake Prime Dispense(Time) Prime Dispense(Pressure) Wafer-Lift Pins On-Board Microprocessor Options FlexiArm™ Robotic Handler Vacuum Pump 150ml Prime-Fluid Flask Fluid Level Sensor                 Specifications Temperature Range:  40ºC-180ºC Temperature Uniformity:  ±1ºC Wafer Contact Angle:  60º-70º on bare  Si Contact Angle Repeatability:  ±3º HMDS Consumption:  Process Dependent (0.1 - 0.2 ml/wafer, typical) Vacuum Capability:  Atmosphere to 10 millitorr Prime Dispense/Time:  0.1-second increments Prime Dispense/Chamber Pressure: User programmed pressure

Hot Plate Module Standard Nickelized Copper Plate with Titanium Nitride Surface Stepper-Motor Lift Pins Contact Bake Vacuum Pull-Down Multiple Proximity Bake Positions Programmable Bake Times Programmable Pin Speed RTD Temperature sensor Nickelized Aluminum Funnel 360º Symmetric Exhaust Safety Snap Switch On-Board Microprocessor  Options FlexiArm™ Robotic Handler Quartz Cover N2 Purge Magnehelic Gauge (Safety Interlocks) Exhaust Controller Hot Plate Uniformity Temperature Range: 40ºC-400ºC Temperature Uniformity: 40ºC-150ºC; ± 0.5ºC 151ºC-400ºC; ± 0.5% Programmable Temperature: 40ºC-400ºC    (in 1ºC increments) Programmable Time: 0-999 seconds (in 0.1 second increments)

	Chill Plate Module Thermoelectric-junction chill mechanism, water-cooled for high-temperature substrates Separate sensors for chill plate and substrate temperatures Three pneumatically-controlled transfer pins Substrate secured to plate by vacuum Programmable from 15ºC-25ºC, in .1ºC increments, controlled to ±0.5ºC Substrate temperature setpoint programmable from chill plate temperature to 25ºC

	Elevator Module FlexiFab's self-contained Elevator Module provides unparalleled process performance and control in substrate handling and transportation. When all of the features inherent to the FlexiFab Elevator Module are merged together, they give the process engineer  the freedom and ability to achieve and maintain repeatable process results. Dedicated to safe and precise substrate handling FlexiFab's Elevator  Module retains its reliability in whatever system configuration your process requires. Compatible with all SEMI-Standard cassettes, the Elevator Module may be used as a Send, Receive, or a Send/Receive  unit. The reliable encoder-driven motor and programmable pitch function combine to give the process engineer complete process control. Standard Nylon-Coated Aluminum Cassette Platten Send Module Receive Module Send/Receive Module Encoder-Controlled Drive Motor Slot-to-Slot Integrity (Send/Receive) Programmable Pitch On-Board Microprocessor  Options FlexiArm™ Robotic Handler Wafer Mapping System ProcessMatrix Software

Buffer Module

FlexiFab's self-contained Buffer Module provides unparalleled process performance and control in substrate handling and system integration. When all of the features  inherent to the FlexiFab Buffer Module are merged together, they give the process engineer the freedom and ability to achieve and maintain repeatable process results.

Dedicated to safe and precise substrate handling FlexiFab's  Buffer Module retains its reliability in whatever system configuration your process requires. The Buffer Module utilizes a stepper motor driven rotational plate, 270º spin radius, and  programmable pitch function to ensure the process engineer risk free substrate transport; while MTI's rugged FlexiArm™ handler drastically reduces the risk of particulate contamination.

Standard

• Nylon-Coated Aluminum Cassette Platten
• Rotational Table
• Stepper Motor Drive
• Low Friction Bearings
• Opto-Sensors for Precise Positioning
• Programmable Pitch
• On-Board Microprocessor

 Options

• FlexiArm™ Robotic Handler
• Process Matrix Software

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